Parameters | |
---|---|
JESD-609 Code | e3 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 48 |
Max Operating Temperature | 85°C |
Min Operating Temperature | -40°C |
Subcategory | Other Telecom ICs |
Max Power Dissipation | 79.5mW |
Technology | BICMOS |
Terminal Position | QUAD |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 3V |
Terminal Pitch | 0.5mm |
Frequency | 10MHz~300MHz |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | AD9874 |
Function | IF Digitizing Subsystem |
Operating Supply Voltage | 3.3V |
Power Supplies | 3/3.33/5V |
Temperature Grade | INDUSTRIAL |
Number of Channels | 1 |
Interface | SPI, Serial |
Max Supply Voltage | 3.6V |
Min Supply Voltage | 2.7V |
Nominal Supply Current | 26.5mA |
Power Dissipation | 79.5mW |
Resolution | 3 B |
Sampling Rate | 26 Msps |
Telecom IC Type | TELECOM CIRCUIT |
Conversion Rate | 541.5 ksps |
RF Type | UHF, Cellular, TETRA, GSM, EDGE, APCO25 |
Secondary Attributes | 16dB Front End Attenuator |
Height | 1.4mm |
Length | 7mm |
Width | 7mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Contains Lead |
Factory Lead Time | 1 Week |
Lifecycle Status | PRODUCTION (Last Updated: 3 weeks ago) |
Contact Plating | Tin |
Mounting Type | Surface Mount |
Package / Case | 48-LQFP |
Surface Mount | YES |
Number of Pins | 48 |
Packaging | Tray |