Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | PRODUCTION (Last Updated: 3 weeks ago) |
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-UFBGA, WLCSP |
Number of Pins | 8 |
Packaging | Tape & Reel (TR) |
JESD-609 Code | e1 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Max Operating Temperature | 85°C |
Min Operating Temperature | -40°C |
Technology | BICMOS |
Voltage - Supply | 2.5V~3.3V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 3V |
Terminal Pitch | 0.5mm |
Frequency | 450MHz~6GHz |
Time@Peak Reflow Temperature-Max (s) | 40 |
Base Part Number | ADL5502 |
Pin Count | 8 |
Qualification Status | Not Qualified |
Temperature Grade | INDUSTRIAL |
Operating Supply Current | 3mA |
Nominal Supply Current | 3mA |
Accuracy | ±0.25dB |
Response Time | 15 μs |
Telecom IC Type | RF AND BASEBAND CIRCUIT |
RF Type | Cellular, CDMA2000, OFDM, W-CDMA |
Input Range | -15dBm ~ 12dBm |
Height Seated (Max) | 0.625mm |
Length | 1.46mm |
Width | 1.46mm |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Contains Lead |