Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | PRODUCTION (Last Updated: 3 weeks ago) |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 56-VFQFN Exposed Pad, CSP |
Number of Pins | 56 |
Packaging | Tray |
JESD-609 Code | e3 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 56 |
ECCN Code | 5A991.B |
Max Operating Temperature | 85°C |
Min Operating Temperature | -40°C |
HTS Code | 8542.39.00.01 |
Subcategory | Other Telecom ICs |
Technology | CMOS |
Voltage - Supply | 3.3V |
Terminal Position | QUAD |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 3.3V |
Terminal Pitch | 0.5mm |
Frequency | 1GHz |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | ADRF6850 |
Function | Demodulator |
Power Supplies | 3.3V |
Temperature Grade | INDUSTRIAL |
Interface | I2C, SPI |
Operating Supply Current | 350mA |
Nominal Supply Current | 350mA |
Max Supply Current | 440mA |
Gain | 60dB |
Telecom IC Type | TELECOM CIRCUIT |
Noise Figure | 11dB |
P1dB | 12dBm |
RF Frequency | 100MHz~1GHz |
Height | 950μm |
Length | 8.1mm |
Width | 8.1mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Contains Lead |