Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 256-LBGA, CABGA |
Number of Pins | 256 |
Operating Temperature | -40°C~85°C |
Packaging | Tray |
Published | 2016 |
Series | FPSLIC® |
JESD-609 Code | e1 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 256 |
Terminal Finish | TIN SILVER COPPER |
HTS Code | 8542.39.00.01 |
Technology | CMOS |
Voltage - Supply | 3V~3.6V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 3.3V |
Terminal Pitch | 1mm |
Frequency | 16MHz |
Time@Peak Reflow Temperature-Max (s) | 40 |
Qualification Status | Not Qualified |
Operating Supply Voltage | 3.3V |
Interface | I2C, UART |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells | 2304 |
EEPROM Size | 1M x 8 |
Core Type | 8-Bit AVR |
Number of Equivalent Gates | 40000 |
Data SRAM Bytes | 4K ~ 16K |
FPGA Gates | 40K |
Program SRAM Bytes | 20K-32K |
FPGA Registers | 2862 |
FPGA SRAM | 18kb |
Height Seated (Max) | 1.5mm |
Length | 17mm |
Width | 17mm |
RoHS Status | ROHS3 Compliant |