B88069X6241T902
| Parameters | |
|---|---|
| Lifecycle Status | PRODUCTION (Last Updated: 1 month ago) |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Package / Case | SMD/SMT |
| Packaging | Tape & Reel (TR) |
| Tolerance | 20% |
| Number of Terminations | 2 |
| Max Operating Temperature | 90°C |
| Min Operating Temperature | -40°C |
| Terminal Position | END |
| Terminal Form | WRAP AROUND |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Depth | 5.4mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Temperature Grade | INDUSTRIAL |
| Insulation Resistance | 1GOhm |
| Number of Poles | 2 |
| Peak Pulse Current | 5kA |
| Telecom IC Type | SURGE PROTECTION CIRCUIT |
| Fail Short | No |
| Diameter | 5.4mm |
| Length | 4mm |
| RoHS Status | RoHS Compliant |
See Relate Datesheet
