C850-100-WH
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 3-SMD, No Lead |
| Packaging | Digi-Reel® |
| Published | 2008 |
| Series | TBU® |
| JESD-609 Code | e3 |
| Part Status | Discontinued |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 3 |
| Termination | SMD/SMT |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Applications | General Purpose |
| Voltage - Rated | 425V |
| Technology | Internal Switch |
| Terminal Position | BOTTOM |
| Terminal Form | BUTT |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Current Rating | 100mA |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | C850 |
| Pin Count | 3 |
| JESD-30 Code | R-XBCC-B3 |
| Qualification Status | Not Qualified |
| Temperature Grade | INDUSTRIAL |
| Number of Circuits | 1 |
| Telecom IC Type | SURGE PROTECTION CIRCUIT |
| Height | 850μm |
| Length | 4mm |
| Width | 8.25mm |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
