Parameters | |
---|---|
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 |
Number of Terminations | 256 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Lead (Sn63Pb37) |
Max Operating Temperature | 85°C |
Min Operating Temperature | -40°C |
HTS Code | 8542.39.00.01 |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 225 |
Supply Voltage | 3.3V |
Time@Peak Reflow Temperature-Max (s) | 20 |
Pin Count | 256 |
Operating Supply Voltage | 5V |
Supply Voltage-Max (Vsup) | 3.46V |
Temperature Grade | INDUSTRIAL |
Interface | PCI, Serial |
uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |
Frequency (Max) | 33MHz |
Data Bus Width | 32b |
Bus Compatibility | MC68360; MPC860 |
Height Seated (Max) | 3.5mm |
Length | 27mm |
Width | 27mm |
Thickness | 2mm |
Radiation Hardening | No |
RoHS Status | Non-RoHS Compliant |
Lead Free | Contains Lead |
Factory Lead Time | 1 Week |
Contact Plating | Lead, Tin |
Mount | Surface Mount |
Package / Case | BGA |
Number of Pins | 256 |
Published | 1999 |