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CY7C68034-56BAXC

CY7C68034-56BAXC datasheet pdf and Memory - Controllers product details from Cypress Semiconductor Corp stock available at Noco


  • Manufacturer: Cypress Semiconductor Corp
  • Nocochips NO: 217-CY7C68034-56BAXC
  • Package: 56-VFBGA
  • Datasheet: PDF
  • Stock: 515
  • Description: CY7C68034-56BAXC datasheet pdf and Memory - Controllers product details from Cypress Semiconductor Corp stock available at Noco(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 56-VFBGA
Number of Pins 56
Supplier Device Package 56-VFBGA (5x5)
Operating Temperature 0°C~70°C
Packaging Tray
Published 2004
Series EZ-USB NX2LP-Flex™
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3V~3.6V
Base Part Number CY7C68034
Controller Type NAND Flash - USB
RoHS Status ROHS3 Compliant
Lead Free Lead Free

CY7C68034-56BAXC Overview


Materials from Tray are used in its packaging. For the purpose of saving board space, it is provided in the 56-VFBGA. Having high quality and reliable performance, the NAND Flash - USB is a type of product. A temperature of 0°C~70°C should be set for the operating environment. It requires a voltage of 3V~3.6V in order to operate normally. The mounting technique used is Surface Mount. More related electronic parts can be found according its base part number CY7C68034. There are 56 channels on this type of electronic apart. The device package is provided by the supplier, 56-VFBGA (5x5). As a member of the EZ-USB NX2LP-Flex? series, it has a high level of acceptance throughout the industry.

CY7C68034-56BAXC Features


Available in the 56-VFBGA package
NAND Flash - USB as controller type
Operating temperature of 0°C~70°C

CY7C68034-56BAXC Applications


There are a lot of Cypress Semiconductor Corp CY7C68034-56BAXC Memory Controllers applications.

  • Embedded modules including U.2, M.2, MO-297 and MO-300
  • microSD cards for consumer and mobile applications
  • eMMC embedded Flash
  • Ultra durable Flash Drive
  • Medical Instrumentation and Industrial Products
  • Microprocessor Systems
  • System-in-Package (SiP) embedded flash drives (eSSD)
  • Servers
  • Solid State Disks (SSD)
  • Multi-Chip-Packages (MCP)

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