CYV15G0401DXB-BGC
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA Exposed Pad |
| Surface Mount | YES |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Series | HOTlink II™ |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | TIN LEAD |
| Technology | BICMOS |
| Voltage - Supply | 3.135V~3.465V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 235 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1.27mm |
| Reach Compliance Code | unknown |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B256 |
| Function | Transceiver |
| Qualification Status | COMMERCIAL |
| Interface | LVTTL |
| Number of Circuits | 4 |
| Current - Supply | 870mA |
| Telecom IC Type | TELECOM CIRCUIT |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | Non-RoHS Compliant |
See Relate Datesheet
