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CYV15G0403DXB-BGI

256 TerminationsTelecom device4 Circuits


  • Manufacturer: Rochester Electronics, LLC
  • Nocochips NO: 699-CYV15G0403DXB-BGI
  • Package: 256-LBGA Exposed Pad
  • Datasheet: PDF
  • Stock: 230
  • Description: 256 TerminationsTelecom device4 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 256-LBGA Exposed Pad
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tray
Series HOTlink II™
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish TIN LEAD
Technology BICMOS
Voltage - Supply 3.135V~3.465V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 235
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Function Transceiver
Qualification Status COMMERCIAL
Interface LVTTL
Number of Circuits 4
Current - Supply 900mA
Telecom IC Type TELECOM CIRCUIT
Length 27mm
Width 27mm
RoHS Status Non-RoHS Compliant

CYV15G0403DXB-BGI Overview


A 256-LBGA Exposed Pad package saves space on a board.Telecommunications equipment is packed in the Tray-way.Surface Mount is used as telecommunications equipment mounting type.A 4-circuit composes this telecom IC .Providing 3.135V~3.465V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.-40°C~85°C is the operating temperature that can be set for reliable performance.As part of its configuration, it includes 256 terminations.With 3.3V as the supply voltage, it operates.As a telecom IC, TELECOM CIRCUIT is used.Wit h a supply current of 900mA, telecom equipment operates.There are many similar functions of the telecommunication product that it can provide with the electronic components under the HOTlink II? series.

CYV15G0403DXB-BGI Features


Available in the 256-LBGA Exposed Pad package
TELECOM CIRCUIT as telecom IC type

CYV15G0403DXB-BGI Applications


There are a lot of Rochester Electronics, LLC CYV15G0403DXB-BGI Telecom applications.

  • T1/E1/J1 Multiplexer and Channel Banks
  • Cross Connects
  • Digital Cross-connect Systems (DCS)
  • SDH/SONET multiplexers
  • Short/Medium Loop
  • Digital subscriber line access multiplexer (DSLAM)
  • SDH Multiplexers
  • T1/E1/J1 LAN/WAN Routers
  • Voice over IP/DSL
  • Voice over packet gateways

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