Parameters | |
---|---|
Factory Lead Time | 1 Week |
Package / Case | Module |
Operating Temperature | -40°C~85°C |
Packaging | Bulk |
Published | 2005 |
Series | Digi Connect ME® |
Size / Dimension | 1.45 x 0.75 36.7mmx19.1mm |
Part Status | Not For New Designs |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Connector Type | RJ45 |
Max Operating Temperature | 85°C |
Min Operating Temperature | -40°C |
Power Rating | 891mW |
Frequency | 55MHz |
Max Output Current | 270mA |
Operating Supply Voltage | 3.3V |
Interface | Ethernet, Serial |
Operating Supply Current | 270mA |
Nominal Supply Current | 250mA |
Speed | 55MHz |
RAM Size | 8MB |
Memory Type | FLASH, NOR, SDRAM |
Core Processor | ARM7TDMI, NS7520 |
Data Rate | 230 kbps |
Density | 15.3 Mb |
Core Architecture | ARM |
Power Consumption | 891mW |
Module/Board Type | MPU Core |
Flash Size | 2MB |
Height | 21.69mm |
Length | 36.7mm |
Width | 19.05mm |
REACH SVHC | Unknown |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |