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DP8421AV-20

DP8421AV-20 datasheet pdf and Memory - Controllers product details from Texas Instruments stock available at Noco


  • Manufacturer: Texas Instruments
  • Nocochips NO: 815-DP8421AV-20
  • Package: 68-LCC (J-Lead)
  • Datasheet: PDF
  • Stock: 794
  • Description: DP8421AV-20 datasheet pdf and Memory - Controllers product details from Texas Instruments stock available at Noco(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 68-LCC (J-Lead)
Operating Temperature 0°C~70°C
Packaging Tube
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Technology CMOS
Voltage - Supply 4.5V~5.5V
Reach Compliance Code unknown
Base Part Number DP8421
Pin Count 68
uPs/uCs/Peripheral ICs Type MEMORY CONTROLLER, DRAM
Controller Type Dynamic RAM (DRAM)
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

DP8421AV-20 Overview


Tube has packaged it with its materials. It is provided in the 68-LCC (J-Lead) to save board space. Dynamic RAM (DRAM) type with high quality and reliability. Set the operating temperature to 0°C~70°C. The voltage required for its normal operation should be provided by 4.5V~5.5V. A technique known as Surface Mount is used to mount the device. In addition to this part number, more related electronic parts are available according to its base part number DP8421. A 68 pin is configured on the board. The uPs/uCs/peripheral ICs of the device are integrated with a type of MEMORY CONTROLLER, DRAM.

DP8421AV-20 Features


Available in the 68-LCC (J-Lead) package
Dynamic RAM (DRAM) as controller type
Operating temperature of 0°C~70°C

DP8421AV-20 Applications


There are a lot of Texas Instruments DP8421AV-20 Memory Controllers applications.

  • PCMCIA or ATA PC cards
  • Discrete on-board flash drive or disk-on-board (DoB) integration
  • NVSRAM Modules
  • High reliability & industrial Solid State Drives (SSD)
  • High reliability & industrial Compact FlashTM Cards (CFC)
  • microSD cards for consumer and mobile applications
  • Internet Appliances
  • Computers
  • Multi-Chip-Package (MCP)
  • Embedded modules including U.2, M.2, MO-297 and MO-300

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