DS1213B
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 28-DIP (0.600, 15.24mm) |
| Surface Mount | NO |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Published | 2001 |
| JESD-609 Code | e0 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 28 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| HTS Code | 8473.30.11.80 |
| Technology | CMOS |
| Voltage - Supply | 4.75V~5.5V |
| Terminal Position | DUAL |
| Peak Reflow Temperature (Cel) | 240 |
| Number of Functions | 1 |
| Terminal Pitch | 2.54mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | DS1213 |
| Pin Count | 28 |
| JESD-30 Code | R-PDIP-T28 |
| Qualification Status | Not Qualified |
| Memory IC Type | MEMORY CIRCUIT |
| Controller Type | Smartsocket SRAM |
| Height Seated (Max) | 11.94mm |
| Length | 35.56mm |
| Width | 15.24mm |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Contains Lead |
DS1213B Overview
A package of materials from Tube is included with the product. As a result, it is provided in the 28-DIP (0.600, 15.24mm) to save space. Smartsocket SRAM type with high quality and reliability. Set the operating temperature to 0°C~70°C. In order for 4.75V~5.5V to operate normally, a voltage must be supplied. Using the Through Hole mounting technique, it is mounted. In addition to this part number, more related electronic parts are available according to its base part number DS1213. Signals are prevented from reflecting off the transmission line end by means of 28 terminations. The pins are configured as 28. It is based on the component with the lowest tolerance for high temperatures that we determine 240's reflow temperature limit.
DS1213B Features
Available in the 28-DIP (0.600, 15.24mm) package
Smartsocket SRAM as controller type
Operating temperature of 0°C~70°C
DS1213B Applications
There are a lot of Maxim Integrated DS1213B Memory Controllers applications.
- Servers
- Multi-Chip-Modules (MCM)
- SmartCards
- Embedded modules including U.2, M.2, MO-297 and MO-300
- microSD cards for consumer and mobile applications
- PCMCIA or ATA PC cards
- Discrete on-board flash drive or disk-on-board (DoB) integration
- SecureDigitial- SD Cards for industrial and consumer applications
- eUSB, embedded USB module
- NVSRAM Modules
