Parameters |
Mounting Type |
Surface Mount |
Package / Case |
16-SOIC (0.295, 7.50mm Width) |
Surface Mount |
YES |
Operating Temperature |
0°C~70°C |
Packaging |
Tube |
JESD-609 Code |
e0 |
Pbfree Code |
no |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
16 |
Terminal Finish |
TIN LEAD |
Technology |
CMOS |
Voltage - Supply |
4.5V~5.5V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
245 |
Supply Voltage |
5V |
Terminal Pitch |
1.27mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Pin Count |
16 |
JESD-30 Code |
R-PDSO-G16 |
Qualification Status |
COMMERCIAL |
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT |
Controller Type |
Static RAM (SRAM) |
Height Seated (Max) |
2.65mm |
Length |
10.3mm |
Width |
7.5mm |
RoHS Status |
Non-RoHS Compliant |
DS1222S Overview
It is packaged with the materials of Tube. In order to save board space, it is provided in the 16-SOIC (0.295, 7.50mm Width). In this case, it is an extremely reliable and high quality type of Static RAM (SRAM). Setting 0°C~70°C as the operating temperature is recommended. It is necessary to provide voltage to 4.5V~5.5V for the device to operate normally. The mounting technique used is Surface Mount. 16 terminations prevent signals from reflecting off the transmission line's end. 5V is the supply voltage of the device. The device has 16 pins configured. It is the component with the lowest tolerance for high temperatures that determines the reflow temperature limit of 245. An uPs/uCs/peripheral IC type is integrated with the MICROPROCESSOR CIRCUIT.
DS1222S Features
Available in the 16-SOIC (0.295, 7.50mm Width) package
Static RAM (SRAM) as controller type
Operating temperature of 0°C~70°C
DS1222S Applications
There are a lot of Rochester Electronics, LLC DS1222S Memory Controllers applications.
- Multi-Chip-Modules (MCM)
- Embedded Flash
- Internet Appliances
- Industrial USB Flash Drive
- SecureDigitial- SD Cards for industrial and consumer applications
- Embedded Systems
- IDE Disk-on-Modules (DoM)
- Security Flash Drive
- Multi-Chip-Package (MCP)
- Solid State Disks (SSD)