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DS26303LN-75+

Telecom device8 Circuits


  • Manufacturer: Rochester Electronics, LLC
  • Nocochips NO: 699-DS26303LN-75+
  • Package: 144-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 420
  • Description: Telecom device8 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 144-LQFP Exposed Pad
Supplier Device Package 144-LQFP-EP (20x20)
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 8
Current - Supply 250mA
RoHS Status ROHS3 Compliant

DS26303LN-75+ Overview


In order to save space on the board, 144-LQFP Exposed Pad packages are used.Packing is done according to the Tray method.A Surface Mount-mount is used for mounting the telecom circuit.8 circuits are used in this telecom IC .3.135V~3.465V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.Reliable performance can be offered when the operating temperature is set at -40°C~85°C.The supply current is 250mA.

DS26303LN-75+ Features


Available in the 144-LQFP Exposed Pad package

DS26303LN-75+ Applications


There are a lot of Rochester Electronics, LLC DS26303LN-75+ Telecom applications.

  • T1/E1/J1 Performance Monitoring
  • ISDN NT1/TA
  • Central office
  • M13 MUX
  • T1/E1/J1 Multiplexer and Channel Banks
  • Digital loop carrier (DLC)
  • E1 Network Equipment
  • Fractional T1/E1/J1
  • Fiber to the Home (FTTH)
  • Cable modem

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