Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Material | Beryllium Copper |
Mounting Type | Through Hole |
Contact Shape | Circular |
Insulation Material | Liquid Crystal Polymer (LCP) |
Housing Material | Polyester |
Operating Temperature | -55°C~125°C |
Packaging | Bulk |
Published | 2011 |
Series | ESS |
JESD-609 Code | e4 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Termination | Solder |
ECCN Code | EAR99 |
Connector Type | Elevated Socket |
Number of Positions | 5 |
Number of Rows | 1 |
Gender | Receptacle |
Fastening Type | Push-Pull |
Contact Finish - Mating | Gold |
MIL Conformance | NO |
DIN Conformance | NO |
IEC Conformance | NO |
Filter Feature | NO |
Contact Type | Female Socket |
Mixed Contacts | NO |
Option | GENERAL PURPOSE |
Orientation | Straight |
Depth | 2.54mm |
Insulation Height | 0.400 10.16mm |
Style | Board to Board |
Number of Positions Loaded | All |
Pitch - Mating | 0.100 2.54mm |
Insulation Color | Black |
Contact Length - Post | 0.123 3.12mm |
Mating Information | MULTIPLE MATING PARTS AVAILABLE |
Contact Resistance | 10mOhm |
Length | 12.7mm |
Contact Finish Thickness - Mating | 10.0μin 0.25μm |
Contact Finish Thickness - Post | 10.0μin 0.25μm |
Material Flammability Rating | UL94 V-0 |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |