FX604P3
| Parameters | |
|---|---|
| Mounting Type | Through Hole |
| Package / Case | 16-DIP (0.300, 7.62mm) |
| Surface Mount | NO |
| Published | 1996 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 16 |
| Additional Feature | HALF DUPLEX |
| HTS Code | 8542.39.00.01 |
| Subcategory | Modems |
| Technology | CMOS |
| Voltage - Supply | 3V~5.5V |
| Terminal Position | DUAL |
| Number of Functions | 1 |
| Supply Voltage | 5V |
| Terminal Pitch | 2.54mm |
| Pin Count | 16 |
| JESD-30 Code | R-PDIP-T16 |
| Qualification Status | Not Qualified |
| Operating Temperature (Max) | 85°C |
| Operating Temperature (Min) | -40°C |
| Power Supplies | 3/5V |
| Temperature Grade | INDUSTRIAL |
| Supply Current-Max | 0.0025mA |
| Data Rate | 1.2 Mbps |
| Telecom IC Type | MODEM |
| Baud Rate | 1.2k |
| Data Format | FSK, V.23 |
| Height Seated (Max) | 4.45mm |
| Length | 19.685mm |
| Width | 7.62mm |
| RoHS Status | Non-RoHS Compliant |
See Relate Datesheet
