HBM15DRAI
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Beryllium Copper |
| Mount | Through Hole |
| Mounting Type | Through Hole, Right Angle |
| Material - Insulation | Polybutylene Terephthalate (PBT) |
| Operating Temperature | -65°C~125°C |
| Packaging | Tray |
| Published | 2015 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Termination | Solder |
| Connector Type | Full Bellows |
| Number of Positions | 30 |
| Color | Blue |
| Number of Rows | 2 |
| Gender | Female |
| Subcategory | Headers and Edge Type Connectors |
| Contact Type | Full Bellows |
| Pitch | 0.156 3.96mm |
| Total Number of Contacts | 30 |
| Number of Conductors | ONE |
| Contact Finish | Gold |
| Reliability | COMMERCIAL |
| Number Of PCB Rows | 2 |
| PCB Contact Pattern | RECTANGULAR |
| Body Depth | 0.431 inch |
| Rated Current (Signal) | 3A |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Number of Positions/Bay/Row | 15 |
| Flange Feature | Top Mount Opening, Threaded Insert, 4-40 |
| Contact Finish Thickness | 10.0μin 0.25μm |
| Plating Thickness | 10μin |
| Card Thickness | 0.062 1.57mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
HBM15DRAI Overview
Material was packaged in accordance with Tray's specifications.Recommended mounting type is Through Hole, Right Angle.Connecting the device uses connector socket Full Bellows.
HBM15DRAI Features
HBM15DRAI Applications
There are a lot of Sullins Connector Solutions HBM15DRAI Edgeboard Connectors applications.
- Cell Phones
- Wireless local loop
- Micro and pico cell systems, software radios
- 3-phase power control
- High Speed Data Acquisition
- Imaging Systems
- Digital beam-forming systems for ultrasound
- Music recording
- Microcontrollers.
- Data Acquisition Systems
