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HDG200-DN-3

HDG200-DN-3 datasheet pdf and RF Transceiver ICs product details from H&D Wireless AB stock available at Noco


  • Manufacturer: H&D Wireless AB
  • Nocochips NO: 335-HDG200-DN-3
  • Package: 44-TQFN Exposed Pad Module
  • Datasheet: PDF
  • Stock: 159
  • Description: HDG200-DN-3 datasheet pdf and RF Transceiver ICs product details from H&D Wireless AB stock available at Noco(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 44-TQFN Exposed Pad Module
Supplier Device Package 44-QFN SIP (8x8)
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type TxRx + MCU
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Voltage - Supply 2.75V~3.6V
Frequency 2.4GHz
Interface SDIO, SPI
Memory Size 1kB EEPROM 160kB SRAM
Protocol 802.11b/g/n
Power - Output 17dBm
RF Family/Standard WiFi
Data Rate (Max) 72.2Mbps
Serial Interfaces SDIO, SPI
Current - Receiving 49mA
Current - Transmitting 197mA
RoHS Status RoHS Compliant

HDG200-DN-3 Overview


The 44-TQFN Exposed Pad Module package conserves RF transceiver IC's board space. Surface Mount is used for RF transceiver's mounting.With transceiver RF's high efficiency and reliable performance, it emerges as a TxRx + MCU.High reliability is achieved using advanced transceiver RF' packaging Tray.A frequency of 2.4GHz is used to operate RF transceiver.

HDG200-DN-3 Features


44-TQFN Exposed Pad Module package
Surface Mount for mounting
TxRx + MCU
Tray is used

HDG200-DN-3 Applications


There are a lot of H&D Wireless AB HDG200-DN-3 RF Transceiver ICs applications.

  • LED Lighting
  • Internet of Things (IoT)
  • Low Noise Amplifier (LNA)
  • Home and Security
  • M2M Communication
  • Transmit
  • HVAC
  • Remote Device Management
  • Utility and Smart Energy

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