Parameters | |
---|---|
Package / Case | SMD/SMT |
Surface Mount | NO |
Operating Temperature | -25°C~85°C |
Packaging | Tape & Reel (TR) |
Published | 2006 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
Terminal Finish | PURE TIN |
Technology | BICMOS |
Voltage - Supply | 2.4V~3.6V |
Terminal Position | SINGLE |
Orientation | Side View |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 3V |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | 10 |
JESD-30 Code | R-XSMA-X8 |
Qualification Status | Not Qualified |
Data Rate | 1.15Mbps (MIR) |
Size | 8.0mmx3.0mmx2.5mm |
Interface IC Type | INTERFACE CIRCUIT |
Standards | IrDA 1.4 |
Idle Current, Typ @ 25°C | 400μA |
Link Range, Low Power | 50cm |
Shutdown | Yes |
RoHS Status | Non-RoHS Compliant |