Parameters |
Factory Lead Time |
1 Week |
Contact Material |
Beryllium Copper |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Housing Material |
Polymer |
Material - Insulation |
Liquid Crystal Polymer (LCP) |
Operating Temperature |
-55°C~125°C |
Packaging |
Tray |
Published |
2013 |
Series |
Edge Rate™ HSEC8 |
JESD-609 Code |
e3 |
Feature |
Board Guide, Board Lock, Locking Ramp |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Termination |
Solder |
Connector Type |
CARD EDGE CONNECTOR |
Number of Positions |
120 |
Color |
Black |
Number of Rows |
2 |
Gender |
Female |
Subcategory |
Headers and Edge Type Connectors |
MIL Conformance |
NO |
DIN Conformance |
NO |
IEC Conformance |
NO |
Filter Feature |
NO |
Contact Type |
Cantilever |
Mixed Contacts |
NO |
Option |
GENERAL PURPOSE |
Pitch |
0.031 0.80mm |
Total Number of Contacts |
120 |
Orientation |
Straight |
Number of Conductors |
ONE |
Contact Finish |
Gold |
Reliability |
COMMERCIAL |
Number Of PCB Rows |
2 |
Body Depth |
0.314 inch |
Contact Resistance |
15mOhm |
Card Type |
Non Specified - Dual Edge |
Read Out |
Dual |
Insulation Resistance |
1000000000Ohm |
Number of Positions/Bay/Row |
60 |
Max Current Rating |
3.1A |
Durability |
1000 Cycles |
Contact Finish Thickness |
30.0μin 0.76μm |
Plating Thickness |
30μin |
Card Thickness |
0.062 1.57mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
HSEC8-160-01-S-DV-A-BL Overview
Tray wanted the material packaged as per his specs.It's recommended to mount type Surface Mount.Connecting the device to the computer is accomplished by using the connector socket CARD EDGE CONNECTOR.Features: Board Guide, Board Lock, Locking Ramp.Edge Rate? HSEC8 indicates the device's series number.
HSEC8-160-01-S-DV-A-BL Features
Edge Rate? HSEC8 series
HSEC8-160-01-S-DV-A-BL Applications
There are a lot of Samtec Inc. HSEC8-160-01-S-DV-A-BL Edgeboard Connectors applications.
- Communication test equipment
- AC motor control
- Handheld Terminal Interface
- Medical Imaging
- Broadband data applications
- Audio/Video devices
- Scientific instruments.
- 4-channel data acquisition
- CMOS Image sensors for mobile applications
- Imaging Systems