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HSS-C2540-SMT-TR

HEAT SINK TO-263 COPPER


  • Manufacturer: CUI Devices
  • Nocochips NO: 207-HSS-C2540-SMT-TR
  • Package: -
  • Datasheet: PDF
  • Stock: 369
  • Description: HEAT SINK TO-263 COPPER (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Material Copper
Shape Rectangular, Fins
Package Cooled TO-263 (D2Pak)
Material Finish Tin
Packaging Tape & Reel (TR)
Series HSS
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Board Level
Height Off Base (Height of Fin) 0.450 11.43mm
Thermal Resistance @ Forced Air Flow 5.50°C/W @ 200 LFM
Thermal Resistance @ Natural 21.90°C/W
Power Dissipation @ Temperature Rise 3.8W @ 75°C
Length 0.763 19.38mm
Width 1.000 25.40mm
RoHS Status RoHS Compliant
See Relate Datesheet

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