Parameters |
Mounting Type |
Surface Mount |
Package / Case |
208-BGA |
Supplier Device Package |
208-PBGA (17x17) |
Operating Temperature |
0°C~70°C |
Packaging |
Tray |
Series |
72T |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
2.375V~2.625V |
Base Part Number |
72T40108 |
Function |
Synchronous |
Current - Supply (Max) |
60mA |
Memory Size |
2.5M 64K x 40 |
Access Time |
3.6ns |
Data Rate |
200MHz |
Bus Directional |
Uni-Directional |
Retransmit Capability |
Yes |
FWFT Support |
Yes |
Programmable Flags Support |
Yes |
Expansion Type |
Depth, Width |
RoHS Status |
Non-RoHS Compliant |
IDT72T40108L5BB Overview
The 208-BGA package contains FIFO memory chip.The package comes in a case of Tray .There is a memory of 2.5M 64K x 40 on the FIFO chip that can be used to store applications and data.To ensure reliable operation, the temperature should be regulated to 0°C~70°C .Surface Mount is the mounting type of the FIFO memory.Operation is based on a supply voltage of 2.375V~2.625V .A component in the 72T series, this is an memory logic.There is a maximum operating current of 60mA in memory IC's supply.In addition, it is among the members of the 72T40108 family.
IDT72T40108L5BB Features
2.5M 64K x 40 memory size
72T series
Best part number of 72T40108
IDT72T40108L5BB Applications
There are a lot of Renesas Electronics America Inc. IDT72T40108L5BB FIFOs Memory applications.
- Transistors
- General Data Collection Applications at Extreme High-Temperatures
- Code converters
- Signal processing
- Thermal Management for DDR3 Memory Modules
- Test site
- Multimedia
- Temporary storage elements
- Data communications
- Desktop Computers