Parameters |
Mount |
Surface Mount |
Package / Case |
BGA |
Published |
2009 |
JESD-609 Code |
e0 |
Moisture Sensitivity Level (MSL) |
3 |
Number of Terminations |
324 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Lead (Sn63Pb37) |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
HTS Code |
8542.32.00.71 |
Subcategory |
FIFOs |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
225 |
Number of Functions |
1 |
Supply Voltage |
2.5V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
30 |
Pin Count |
324 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
2.625V |
Power Supplies |
1.5/2.52.5V |
Temperature Grade |
COMMERCIAL |
Supply Voltage-Min (Vsup) |
2.375V |
Operating Mode |
SYNCHRONOUS |
Clock Frequency |
200MHz |
Access Time |
5 ns |
Organization |
32KX40 |
Memory Width |
40 |
Memory Density |
1310720 bit |
Parallel/Serial |
PARALLEL |
Memory IC Type |
OTHER FIFO |
Output Enable |
YES |
Height Seated (Max) |
1.97mm |
Length |
19mm |
Width |
19mm |
RoHS Status |
Non-RoHS Compliant |
IDT72T51248L5BB Overview
BGA is a package that contains FIFO memory chip.It is pointing in the direction of Surface Mount .When the supply voltage is 2.5V , high efficiency is possible.In FIFO means, there are 324 terminations.The FIFO products must be run at a minimum temperature of 0°C degrees Celsius to ensure reliability.An operating temperature of 70°C °C is necessary for stable operation.The gadget in FIFOs is self-contained.ICs of type OTHER FIFO are used in the FIFO memory chip.Approximately 324 pins are attached to it.It is normal for the component to own 1.5/2.52.5V power supplies.There is a FIFO memory IC's maximum supply voltage of 2.625V (Vsup).Maintain the supply voltage (Vsup) above 2.375V for normal operation.The FIFO memory IC runs at a frequency of 200MHz .
IDT72T51248L5BB Features
FIFOs category
Clock frequency of 200MHz
IDT72T51248L5BB Applications
There are a lot of Integrated Device Technology (IDT) IDT72T51248L5BB FIFOs Memory applications.
- Telecommunication
- SPI Bus Flash Memory Device
- Tape controllers
- Extended product-change notification
- General Data Collection Applications at Low-Temperatures
- PC peripheral
- Wireless
- Temporary storage elements
- Network bridges
- Thermal Management for DDR3 Memory Modules