Parameters |
Mount |
Surface Mount |
Package / Case |
BGA |
Number of Pins |
256 |
Published |
2005 |
JESD-609 Code |
e1 |
Moisture Sensitivity Level (MSL) |
3 |
Number of Terminations |
256 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Additional Feature |
RETRANSMIT |
HTS Code |
8542.32.00.71 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
1 |
Supply Voltage |
3.3V |
Terminal Pitch |
1mm |
Frequency |
100MHz |
Time@Peak Reflow Temperature-Max (s) |
30 |
Pin Count |
256 |
Qualification Status |
Not Qualified |
Operating Supply Voltage |
3.3V |
Temperature Grade |
COMMERCIAL |
Max Supply Voltage |
3.45V |
Min Supply Voltage |
3.15V |
Element Configuration |
Dual |
Nominal Supply Current |
75mA |
Access Time |
10 ns |
Direction |
Unidirectional |
Organization |
512X72 |
Memory Width |
72 |
Density |
36 kb |
Parallel/Serial |
PARALLEL |
Sync/Async |
Synchronous |
Word Size |
72b |
Output Enable |
YES |
Height Seated (Max) |
3.5mm |
Length |
17mm |
Width |
17mm |
RoHS Status |
RoHS Compliant |
IDT72V7230L10BBG Overview
FIFO memory chip is included in the BGA package.Memory IC's recommended mounted way is Surface Mount .When the supply voltage is 3.3V there is the possibility of high efficiency.256 terminations are contained in FIFO means.The operation pins are 256 pins.In order to maximize efficiency, the supply voltage should be set to 3.3V .It is designed to run at a minimum temperature of 0°C degrees Celsius to ensure reliability.A memory logic's maximum operating temperature of 70°C degrees Celsius assures stable operation.The FIFO memory chip may be operated at very low supply voltages, such as3.15V volts.FIFO memory can handle a maximum supply voltage of 3.45V V.There are a total of 256 pins on this FIFO memory IC.A frequency of 100MHz is capable of maintaining good accuracy.It is also possible to generate RETRANSMIT using this FIFO memory.
IDT72V7230L10BBG Features
IDT72V7230L10BBG Applications
There are a lot of Integrated Device Technology (IDT) IDT72V7230L10BBG FIFOs Memory applications.
- Thermal Management for DDR3 Memory Modules
- General Data Collection Applications at Extreme High-Temperatures
- Multimedia
- Measurement Equipment
- Magnetic memories
- Game Controller
- Portable Information Devices
- Fabrication Site
- Look-up Tables
- Laser Receiver System