Parameters | |
---|---|
Packaging | Tape & Reel (TR) |
Published | 1997 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
ECCN Code | EAR99 |
Resistance | 50mOhm |
Terminal Finish | Matte Tin (Sn) |
Additional Feature | ULTRA LOW RESISTANCE |
Voltage - Rated DC | 30V |
Max Power Dissipation | 2W |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Current Rating | 4.9A |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | IRF7303PBF |
Number of Elements | 2 |
Element Configuration | Dual |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2W |
Turn On Delay Time | 6.8 ns |
FET Type | 2 N-Channel (Dual) |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 50m Ω @ 2.4A, 10V |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 520pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs | 25nC @ 10V |
Rise Time | 21ns |
Fall Time (Typ) | 7.7 ns |
Turn-Off Delay Time | 22 ns |
Continuous Drain Current (ID) | 4.9A |
Threshold Voltage | 1V |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 30V |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
Recovery Time | 71 ns |
FET Feature | Standard |
Nominal Vgs | 1 V |
Height | 1.4986mm |
Length | 4.9784mm |
Width | 3.9878mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-SOIC (0.154, 3.90mm Width) |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |