Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-SOIC (0.154, 3.90mm Width) |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2001 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
ECCN Code | EAR99 |
Resistance | 50mOhm |
Additional Feature | ULTRA LOW RESISTANCE |
Subcategory | Other Transistors |
Max Power Dissipation | 1.4W |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Current Rating | 4A |
Base Part Number | IRF7309PBF |
Number of Elements | 2 |
Row Spacing | 6.3 mm |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 1.4W |
FET Type | N and P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 50m Ω @ 2.4A, 10V |
Vgs(th) (Max) @ Id | 1V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 520pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 4A 3A |
Gate Charge (Qg) (Max) @ Vgs | 25nC @ 4.5V |
Polarity/Channel Type | N-CHANNEL AND P-CHANNEL |
Turn-Off Delay Time | 25 ns |
Continuous Drain Current (ID) | 4A |
Threshold Voltage | 1V |
Gate to Source Voltage (Vgs) | 20V |
Drain Current-Max (Abs) (ID) | 4A |
Drain to Source Breakdown Voltage | 30V |
Pulsed Drain Current-Max (IDM) | 16A |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
FET Feature | Standard |
Nominal Vgs | 1 V |
Height | 1.4986mm |
Length | 4.9784mm |
Width | 4.05mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |