Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-SOIC (0.154, 3.90mm Width) |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2008 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) |
Subcategory | FET General Purpose Power |
Max Power Dissipation | 2W |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | IRF7907PBF |
Number of Elements | 2 |
Element Configuration | Dual |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2W |
FET Type | 2 N-Channel (Dual) |
Rds On (Max) @ Id, Vgs | 16.4m Ω @ 9.1A, 10V |
Vgs(th) (Max) @ Id | 2.35V @ 25μA |
Input Capacitance (Ciss) (Max) @ Vds | 850pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 9.1A 11A |
Gate Charge (Qg) (Max) @ Vgs | 10nC @ 4.5V |
Continuous Drain Current (ID) | 11A |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 30V |
Avalanche Energy Rating (Eas) | 15 mJ |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
FET Feature | Logic Level Gate |
Height | 1.4986mm |
Length | 4.9784mm |
Width | 3.9878mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |