Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-252-3, DPak (2 Leads + Tab), SC-63 |
Number of Pins | 3 |
Supplier Device Package | D-Pak |
Operating Temperature | -55°C~175°C TJ |
Packaging | Tape & Reel (TR) |
Published | 1998 |
Series | HEXFET® |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | SMD/SMT |
Resistance | 210mOhm |
Max Operating Temperature | 175°C |
Min Operating Temperature | -55°C |
Voltage - Rated DC | 100V |
Technology | MOSFET (Metal Oxide) |
Current Rating | 9.1A |
Number of Elements | 1 |
Number of Channels | 1 |
Power Dissipation-Max | 48W Tc |
Element Configuration | Single |
Power Dissipation | 39W |
Turn On Delay Time | 4.5 ns |
FET Type | N-Channel |
Rds On (Max) @ Id, Vgs | 210mOhm @ 5.6A, 10V |
Vgs(th) (Max) @ Id | 4V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 330pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 9.4A Tc |
Gate Charge (Qg) (Max) @ Vgs | 25nC @ 10V |
Rise Time | 23ns |
Drain to Source Voltage (Vdss) | 100V |
Drive Voltage (Max Rds On,Min Rds On) | 10V |
Vgs (Max) | ±20V |
Fall Time (Typ) | 23 ns |
Turn-Off Delay Time | 32 ns |
Continuous Drain Current (ID) | 9.4A |
Threshold Voltage | 4V |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 100V |
Dual Supply Voltage | 100V |
Input Capacitance | 330pF |
Recovery Time | 150 ns |
Max Junction Temperature (Tj) | 175°C |
Drain to Source Resistance | 210mOhm |
Rds On Max | 210 mΩ |
Nominal Vgs | 4 V |
Height | 2.52mm |
Length | 6.7056mm |
Width | 6.22mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |