Parameters | |
---|---|
Number of Terminations | 5 |
ECCN Code | EAR99 |
Resistance | 5.5MOhm |
Additional Feature | HIGH RELIABILITY |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 40 |
JESD-30 Code | R-PDSO-N5 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 3.6W Ta 160W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 160W |
Case Connection | DRAIN |
Turn On Delay Time | 23 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 4.4m Ω @ 50A, 10V |
Vgs(th) (Max) @ Id | 2.5V @ 150μA |
Input Capacitance (Ciss) (Max) @ Vds | 5360pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 20A Ta 100A Tc |
Gate Charge (Qg) (Max) @ Vgs | 90nC @ 10V |
Rise Time | 48ns |
Drive Voltage (Max Rds On,Min Rds On) | 4.5V 10V |
Vgs (Max) | ±16V |
Fall Time (Typ) | 15 ns |
Turn-Off Delay Time | 28 ns |
Continuous Drain Current (ID) | 100A |
Threshold Voltage | 1V |
Gate to Source Voltage (Vgs) | 16V |
Drain Current-Max (Abs) (ID) | 20A |
Drain to Source Breakdown Voltage | 60V |
Pulsed Drain Current-Max (IDM) | 400A |
Nominal Vgs | 1 V |
Height | 838.2μm |
Length | 5.9944mm |
Width | 5.0038mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | RoHS Compliant |
Lead Free | Lead Free |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-PowerVDFN |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2012 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |