Parameters | |
---|---|
Drain to Source Breakdown Voltage | 30V |
Nominal Vgs | 800 mV |
Height | 1mm |
Length | 3.3mm |
Width | 3.3mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-VQFN Exposed Pad |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2004 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 5 |
ECCN Code | EAR99 |
Resistance | 4.5MOhm |
Terminal Finish | Matte Tin (Sn) |
Subcategory | FET General Purpose Power |
Technology | MOSFET (Metal Oxide) |
Terminal Position | DUAL |
JESD-30 Code | S-PDSO-N5 |
Number of Elements | 1 |
Configuration | SINGLE WITH BUILT-IN DIODE |
Power Dissipation-Max | 2.7W Ta 37W Tc |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 37W |
Case Connection | DRAIN |
Turn On Delay Time | 9.1 ns |
FET Type | N-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 3.5m Ω @ 20A, 4.5V |
Vgs(th) (Max) @ Id | 1.1V @ 50μA |
Input Capacitance (Ciss) (Max) @ Vds | 3170pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 21A Ta 40A Tc |
Gate Charge (Qg) (Max) @ Vgs | 62nC @ 4.5V |
Rise Time | 32ns |
Drive Voltage (Max Rds On,Min Rds On) | 2.5V 10V |
Vgs (Max) | ±12V |
Fall Time (Typ) | 43 ns |
Turn-Off Delay Time | 65 ns |
Continuous Drain Current (ID) | 21A |
Threshold Voltage | 800mV |
Gate to Source Voltage (Vgs) | 12V |