Parameters | |
---|---|
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2011 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) |
Subcategory | FET General Purpose Power |
Max Power Dissipation | 1.5W |
Base Part Number | IRLHS6376 |
Number of Elements | 2 |
Element Configuration | Dual |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 1.5W |
Case Connection | DRAIN |
Turn On Delay Time | 4.4 ns |
FET Type | 2 N-Channel (Dual) |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 63m Ω @ 3.4A, 4.5V |
Vgs(th) (Max) @ Id | 1.1V @ 10μA |
Input Capacitance (Ciss) (Max) @ Vds | 270pF @ 25V |
Gate Charge (Qg) (Max) @ Vgs | 2.8nC @ 4.5V |
Rise Time | 11ns |
Drain to Source Voltage (Vdss) | 30V |
Fall Time (Typ) | 9.4 ns |
Turn-Off Delay Time | 11 ns |
Continuous Drain Current (ID) | 3.6A |
Threshold Voltage | 800mV |
Gate to Source Voltage (Vgs) | 12V |
Drain Current-Max (Abs) (ID) | 3.4A |
Drain-source On Resistance-Max | 0.082Ohm |
Drain to Source Breakdown Voltage | 30V |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
FET Feature | Logic Level Gate |
Nominal Vgs | 800 mV |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 6-VDFN Exposed Pad |
Number of Pins | 6 |