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ISL5586DIMZ

28 TerminationsTelecom device1 Circuits


  • Manufacturer: Rochester Electronics, LLC
  • Nocochips NO: 699-ISL5586DIMZ
  • Package: 28-LCC (J-Lead)
  • Datasheet: PDF
  • Stock: 628
  • Description: 28 TerminationsTelecom device1 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 28-LCC (J-Lead)
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tube
Series RSLIC18
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 28
Terminal Finish MATTE TIN
Power (Watts) 305mW
Technology BIPOLAR
Voltage - Supply 5V
Terminal Position QUAD
Terminal Form J BEND
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PQCC-J28
Function Subscriber Line Interface Concept (SLIC)
Qualification Status COMMERCIAL
Number of Circuits 1
Current - Supply 5mA
Height Seated (Max) 4.57mm
RoHS Status ROHS3 Compliant

ISL5586DIMZ Overview


A 28-LCC (J-Lead) package saves space on a board.A Tube-packing method is used to pack telecommunications equipment.Surface Mount is used as telecommunications equipment mounting type.An 1-circuit makes up this telecom IC .The supply voltage of 5V can increase efficiency.Using -40°C~85°C as the operating temperature can result in reliable performance.Configuration of this telecom circuit has 28 terminations.There is a voltage supply called 5V that it uses.There is a supply current of 5mA for telecom equipment to operate on.There are many similarities between it and the electronic parts of the RSLIC18 series.

ISL5586DIMZ Features


Available in the 28-LCC (J-Lead) package

ISL5586DIMZ Applications


There are a lot of Rochester Electronics, LLC ISL5586DIMZ Telecom applications.

  • T1/E1/J1 LAN/WAN Routers
  • Residential Gateways
  • Voice over packet gateways
  • Multi-Line E1 Interface Cards
  • CSU/DSU E1/T1/J1 Interface
  • PCM Test Equipment
  • E2 Rates PCM Line Interface
  • E1 LAN/WAN Routers
  • Public switching systems
  • High-Density T1/E1/J1 interfaces for Multiplexers

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