Parameters |
Mount |
Surface Mount |
Package / Case |
DFN |
Number of Pins |
8 |
Published |
2004 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
2 |
Number of Terminations |
8 |
ECCN Code |
EAR99 |
Terminal Finish |
Matte Tin (Sn) - annealed |
Max Operating Temperature |
70°C |
Min Operating Temperature |
0°C |
Subcategory |
Power Management Circuits |
Terminal Position |
DUAL |
Terminal Form |
NO LEAD |
Peak Reflow Temperature (Cel) |
260 |
Number of Functions |
1 |
Supply Voltage |
5V |
Terminal Pitch |
0.65mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
5.5V |
Power Supplies |
5V |
Temperature Grade |
COMMERCIAL |
Supply Voltage-Min (Vsup) |
2.3V |
Number of Channels |
2 |
Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT |
Adjustable Threshold |
NO |
Height Seated (Max) |
1mm |
Length |
3mm |
Width |
3mm |
RoHS Status |
RoHS Compliant |
ISL61852HCRZ Overview
You get it with the DFN package.Currently, there are 2 channels accessible.The terminations total 8.A device's terminal position is DUAL.An efficient supply voltage is possible with 5V.For operation, 8 pins are used.There is nothing else in Power Management Circuits but this gadget.Positioned in direction of Surface Mount, it is at a right angle.Stable operation is enabled by a maximum operating temperature of 70°C°C.Hot-swappable device operates at a minimum temperature of 0°C degrees Celsius in order to ensure reliabilHot-swappable devicey.Hot-swappable device is recommended to keep the supply voltage (Vsup) above 2.3V so that the device can function normally.There is a value of 5.5V set for Vsup (maximum supply voltage).Hot-swappable device is important to note that the part has a power supply 5V.As you can see in this example, the gadget uses an analog IC called POWER SUPPLY SUPPORT CIRCUIT.
ISL61852HCRZ Features
ISL61852HCRZ Applications
There are a lot of Intersil (Renesas Electronics America) ISL61852HCRZ hot swap controllers applications.
- Power monitoring
- Identify faulty boards
- PC board hot swap insertion and removal
- Redundant-array-of-independent-disk (RAID) storage
- Telecommunications
- Current monitoring
- Networking
- Server backplane system
- USB interface
- Redundant Array of Disks (RAID)