Parameters | |
---|---|
Terminal Form | WRAP AROUND |
Pin Count | 2 |
Reference Standard | MIL-19500/444 |
Qualification Status | Qualified |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Small Signal =< 200mA (Io), Any Speed |
Diode Type | Schottky |
Current - Reverse Leakage @ Vr | 200nA @ 100V |
Voltage - Forward (Vf) (Max) @ If | 1V @ 15mA |
Case Connection | ISOLATED |
Forward Current | 33mA |
Operating Temperature - Junction | -65°C~150°C |
Output Current-Max | 0.033A |
Forward Voltage | 1V |
Max Reverse Voltage (DC) | 70V |
Average Rectified Current | 33mA |
Max Repetitive Reverse Voltage (Vrrm) | 70V |
Capacitance @ Vr, F | 2pF @ 0V 1MHz |
Radiation Hardening | No |
RoHS Status | Non-RoHS Compliant |
Lead Free | Contains Lead |
Factory Lead Time | 1 Week |
Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DO-213AA |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 1997 |
Series | Military, MIL-PRF-19500/444 |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Lead (Sn/Pb) |
Max Operating Temperature | 150°C |
Min Operating Temperature | -65°C |
Additional Feature | METALLURGICALLY BONDED |
HTS Code | 8541.10.00.70 |
Terminal Position | END |