Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 5 days ago) |
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-WFBGA, DSBGA |
Number of Pins | 8 |
Packaging | Tape & Reel (TR) |
JESD-609 Code | e1 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Voltage - Supply | 2.5V~3.3V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 2.7V |
Terminal Pitch | 0.5mm |
Frequency | 50MHz~2GHz |
Base Part Number | LMV232 |
Operating Temperature (Min) | -40°C |
Operating Supply Voltage | 3.3V |
Temperature Grade | INDUSTRIAL |
Number of Channels | 2 |
Operating Supply Current | 13mA |
Element Configuration | Dual |
Nominal Supply Current | 9.8mA |
Accuracy | ±1dB |
Telecom IC Type | RF AND BASEBAND CIRCUIT |
RF Type | Cellular, CDMA, CDMA2000, EDGE, GSM, GPRS, TDMA, W-CDMA |
Input Range | -11dBm ~ 13dBm |
Height | 675μm |
Length | 2mm |
Width | 1.3mm |
Thickness | 675μm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |