Parameters | |
---|---|
Mounting Type | Surface Mount |
Package / Case | 88-BBGA Module |
Surface Mount | YES |
Operating Temperature | -40°C~125°C |
Packaging | Tray |
Published | 2015 |
Series | µModule® |
Size / Dimension | 0.60Lx0.44W x 0.13 H 15.2mmx11.2mmx3.4mm |
JESD-609 Code | e1 |
Feature | OTP |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 88 |
Type | Non-Isolated PoL Module |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Applications | ITE (Commercial) |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Number of Functions | 1 |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | LTM8054 |
Pin Count | 88 |
JESD-30 Code | R-PBGA-B88 |
Number of Outputs | 1 |
Voltage - Input (Max) | 36V |
Voltage - Output 1 | 1.2V~36V |
Voltage - Input (Min) | 5V |
Input Voltage-Nom | 6V |
Current - Output (Max) | 5.4A |
Control Mode | CURRENT-MODE |
Control Technique | PULSE WIDTH MODULATION |
Switcher Configuration | BUCK-BOOST |
Switching Frequency-Max | 800kHz |
Height Seated (Max) | 3.62mm |
RoHS Status | ROHS3 Compliant |
Factory Lead Time | 1 Week |