Parameters |
Number of I/O |
138 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
138 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 25K Logic Modules |
Number of Logic Cells |
27696 |
Flash Size |
256KB |
Height Seated (Max) |
1.56mm |
Length |
14mm |
Width |
14mm |
RoHS Status |
Non-RoHS Compliant |
Factory Lead Time |
1 Week |
Package / Case |
256-LFBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
Additional Feature |
LG-MIN, WD-MIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B256 |
Number of Outputs |
138 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.There is a 256-LFBGA package assigned to this system on a chip by the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion?2 series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.This SoC security combines FPGA - 25K Logic Modules and that is something to note.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part is comprised of 138 inputs and outputs.A 1.2V power supply should be used.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.There is a possibility that it can be powered by a power supply of at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 256 terminations, so system on a chip is really aided by this.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 138 outputs.You will need to provide 1.2V power supplies in order to run system on chip.There are 138 inputs available on the SoC chip.Logic system on chips consist of 27696 logic cells.This flash has a size of 256KB.Moreover, this SoC processor also includes LG-MIN, WD-MIN as its additional features.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025T-1VF256I System On Chip (SoC) applications.
- Body control module
- Sensor network-on-chip (sNoC)
- Published Paper
- Sports
- External USB hard disk/SSD
- DC-input BLDC motor drive
- Mouse
- sequence controllers
- Functional safety for critical applications in the aerospace
- Cyberphysical system-on-chip