M2S060T-FGG676I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 676-BGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Terminal Finish | MATTE TIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Number of Outputs | 387 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 387 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 387 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.Package 676-BGA is assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion?2 series.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.Taking note of the fact that this SoC security combines FPGA - 60K Logic Modules is important.A state-of-the-art Tray package houses this SoC system on a chip.Total I/Os on this SoC part are 387.Ideally, a power supply with a voltage of 1.2V should be used.In the SoCs wireless, voltages above 1.26V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 1.14V.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.In total, there are 676 terminations, which makes system on a chip possible.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.There is the option to have 387 outputs on this SoC chip.A power supply of 1.2V is required.There are 387 inputs available on the SoC chip.A logic SoC has 56520 logic cells.This flash has a size of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060T-FGG676I System On Chip (SoC) applications.
- Keywords
- Communication network-on-Chip (cNoC)
- Microprocessors
- ARM Cortex M4 microcontroller
- Servo drive control module
- Robotics
- Industrial automation devices
- Vending machines
- Industrial sectors
- Cyberphysical system-on-chip
