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M2S150-FC1152I

-40°C~100°C TJ System On ChipSmartFusion?2 Series 574 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S150-FC1152I
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 314
  • Description: -40°C~100°C TJ System On ChipSmartFusion?2 Series 574 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 1152-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B1152
Number of Outputs 574
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 574
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 574
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
Height Seated (Max) 2.9mm
Length 35mm
Width 35mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.Its package is 1152-BBGA, FCBGA.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Internally, this SoC design uses the MCU, FPGA technique.It is part of the SmartFusion?2 series of system on a chips.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of FPGA - 150K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.In total, this SoC part has 574 I/Os.A 1.2V power supply should be used.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.Power supplies of at least 1.14V are required.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.A SoC chip with 574 outputs is available.In order to operate system on chip, you will need 1.2V power supplies.On the SoC chip, there are 574 inputs available for use.There are 146124 logic cells in the logic system on chips.A flashing 512KB appears on it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation


M2S150-FC1152I System On Chip (SoC) applications.

  • Mobile computing
  • Three phase UPS
  • Digital Media
  • Samsung galaxy gear
  • Sensor network-on-chip (sNoC)
  • Body control module
  • Fitness
  • Medical
  • Robotics
  • Apple smart watch

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