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M2S150TS-1FC1152

0°C~85°C TJ System On ChipSmartFusion?2 Series 574 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S150TS-1FC1152
  • Package: 1152-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 189
  • Description: 0°C~85°C TJ System On ChipSmartFusion?2 Series 574 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 1152-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish Tin/Lead (Sn/Pb)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B1152
Number of Outputs 574
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 574
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 574
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124
Flash Size 512KB
Height Seated (Max) 2.9mm
Length 35mm
Width 35mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 1152-BBGA, FCBGA package.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion?2 series.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.Taking note of the fact that this SoC security combines FPGA - 150K Logic Modules is important.Housed in the state-of-art Tray package.An integral part of this SoC consists of a total of 574 I/Os.Use a power supply with a voltage of 1.2V if possible.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.At least 1.14V can be supplied as a power source.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.You can have 574 user outputs for this SoC chip.System on chip requires 1.2V power supplies.A SoC chip with 574 inputs is available.The logic system on chips contain 146124 logic cells.A flashing 512KB appears on it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation


M2S150TS-1FC1152 System On Chip (SoC) applications.

  • High-end PLC
  • ARM
  • Communication network-on-Chip (cNoC)
  • Sensor network-on-chip (sNoC)
  • POS Terminals
  • AC-input BLDC motor drive
  • Cyber security for critical applications in the aerospace
  • Robotics
  • Self-aware system-on-chip (SoC)
  • Efficient hardware for inference of neural networks

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