MC33FS6500CAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6500CAER2 Overview
Tape & Reel (TR) is acceptable for shipping the power management.The package is conveniently packaged the power management in 48-LQFP Exposed Pad .The Surface Mount mounting method allows for easy adaptation.It targets applications such as System Basis Chip and others.To ensure proper functioning, the operating temperature of the power management ic should be set to -40°C~125°C .The power management works at 1V~5V voltage.
MC33FS6500CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6500CAER2 Applications
There are a lot of NXP USA Inc. MC33FS6500CAER2Power Management applications.
- Desktop PC
- Computing
- Tablet PCs
- DDR-II Termination Voltage
- Equipment Run-Off of Battery Backup
- Communications payload
- Electronic Test Equipment
- I/Os (FPGAs, ASICs, DSPs)
- Power Factor Correction
- SSTL-18 Termination
