MC33FS6522LAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6522LAE Overview
The way of Tray is acceptable for shipping the power management.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.Surface Mount is a universal mounting method that is easy to adapt.It targets applications such as System Basis Chip and others.Ideally, the operating temperature of the power management ic should be set at -40°C~125°C in order to prevent malfunction.For its operation, the power management uses 1V~5V voltage.
MC33FS6522LAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6522LAE Applications
There are a lot of NXP USA Inc. MC33FS6522LAEPower Management applications.
- Measurement of Point Voltages
- Applications Processors
- Portable Systems
- Tablets
- Electronic Test Equipment
- Telecommunication
- Environmental Test
- LTE modem
- SSTL-3 Termination
- Hearing Aids
