MC33FS6523NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS6523NAE Overview
Using Tray as a shipping the power management path is acceptable.Packing in 48-LQFP Exposed Pad makes transportation convenient.The Surface Mount mounting method is universal for easy adaptation.It is intended to be used at System Basis Chip as well as for other applications.A temperature setting of -40°C~125°C is recommended to avoid malfunctions.As a result, this power management is powered by 1V~5V voltage.
MC33FS6523NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS6523NAE Applications
There are a lot of NXP USA Inc. MC33FS6523NAEPower Management applications.
- System Thermal for Servers
- Industrial Equipment
- Measurement of Point Voltages
- Cluster
- DDR2 Termination Voltage
- Automotive Infotainment
- System Thermal for PCs
- Isolated DC-DC Modules
- Debug
- SSTL-2 Termination
