MC33PF8100CEES
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
MC33PF8100CEES Overview
The way of Tray is acceptable for shipping the power management.It is packaged the power management in 56-VFQFN Exposed Pad for convenient transportation.The Surface Mount, Wettable Flank mounting method is universal for easy adaptation.The power management is targeted at High Performance i.MX 8, S32x Processor Based and other applications.The operating temperature of the power management ic should be set to -40°C~105°C TA to avoid mal-function.For its operation, the power management uses 2.5V~5.5V voltage.
MC33PF8100CEES Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
MC33PF8100CEES Applications
There are a lot of NXP USA Inc. MC33PF8100CEESPower Management applications.
- Wireless routers
- Termination Voltage
- DDR-II Termination Voltage
- SSTL-3 Termination
- Office Electronics
- Debug
- System Thermal for Servers
- Server Backplane Systems
- Automotive Digital Cluster
- Servers
