Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 18-SOIC (0.295, 7.50mm Width) |
Number of Pins | 18 |
Operating Temperature | -40°C~125°C |
Packaging | Tube |
Published | 2008 |
JESD-609 Code | e3 |
Feature | POR |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 18 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) - annealed |
Max Power Dissipation | 700mW |
Technology | CMOS |
Voltage - Supply | 1.8V~5.5V |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 5V |
Time@Peak Reflow Temperature-Max (s) | 40 |
Base Part Number | MCP23009 |
Pin Count | 18 |
Qualification Status | Not Qualified |
Output Type | Open Drain |
Power Supplies | 2/5V |
Number of Channels | 1 |
Interface | I2C |
Number of I/O | 8 |
Number of Ports | 1 |
Nominal Supply Current | 1mA |
Output Current | 25mA |
Number of Bits | 8 |
Clock Frequency | 3.4MHz |
Interrupt Output | Yes |
Height Seated (Max) | 2.65mm |
Width | 7.5mm |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |