MEC1-120-02-L-D-EM2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Phosphor Bronze |
| Mount | Edge |
| Mounting Type | Surface Mount |
| Housing Material | Polymer |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~125°C |
| Packaging | Tray |
| Published | 2010 |
| Series | MEC1 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Number of Positions | 40 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Additional Feature | POLARIZED |
| MIL Conformance | NO |
| DIN Conformance | NO |
| IEC Conformance | NO |
| Filter Feature | NO |
| Contact Type | Loop Bellows |
| Mixed Contacts | NO |
| Option | GENERAL PURPOSE |
| Pitch | 0.039 1.00mm |
| Orientation | Straight |
| Number of Conductors | ONE |
| Contact Finish | Gold |
| Reliability | COMMERCIAL |
| Body Length or Diameter | 1.356 inch |
| Number Of PCB Rows | 2 |
| Number of Contacts | 38 |
| Body Depth | 0.555 inch |
| Rated Current (Signal) | 1.8A |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Body/Shell Style | SOCKET |
| Contact Finish Thickness | 10.0μin 0.25μm |
| Plating Thickness | 10μin |
| Card Thickness | 0.062 1.57mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
MEC1-120-02-L-D-EM2 Overview
Materials were packaged according to Tray's specs.The mounting type Surface Mount should be used.MEC1 indicates the device series.The following additional features are provided by this chip: POLARIZED
MEC1-120-02-L-D-EM2 Features
MEC1 series
MEC1-120-02-L-D-EM2 Applications
There are a lot of Samtec Inc. MEC1-120-02-L-D-EM2 Edgeboard Connectors applications.
- Wireless and wired broadband communications
- Micro and pico cell systems, software radios
- 3-phase power control
- GSM, EDGE, PHS, UMTS, WCDMA, CDMA2000,
- AC motor control
- Digital Storage Oscilloscope
- Smart antenna systems
- Audio/Video devices
- Cell Phones
- CMOS Image sensors for mobile applications
