Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 6-XFDFN Exposed Pad |
Number of Pins | 6 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2016 |
JESD-609 Code | e4 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 6 |
ECCN Code | EAR99 |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
Max Power Dissipation | 370mW |
Terminal Position | DUAL |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Reference Standard | AEC-Q101 |
Number of Elements | 2 |
Configuration | SEPARATE, 2 ELEMENTS |
Case Connection | COLLECTOR |
Power - Max | 370mW |
Transistor Application | SWITCHING |
Polarity/Channel Type | NPN AND PNP |
Transistor Type | NPN, PNP Complementary |
Collector Emitter Voltage (VCEO) | 300mV |
Max Collector Current | 200mA |
DC Current Gain (hFE) (Min) @ Ic, Vce | 100 @ 10mA 1V |
Current - Collector Cutoff (Max) | 50nA |
Vce Saturation (Max) @ Ib, Ic | 300mV @ 5mA, 50mA |
Collector Emitter Breakdown Voltage | 40V |
Transition Frequency | 300MHz |
Max Breakdown Voltage | 40V |
Frequency - Transition | 300MHz |
Turn Off Time-Max (toff) | 250ns |
Turn On Time-Max (ton) | 70ns |
RoHS Status | ROHS3 Compliant |