Parameters | |
---|---|
Manufacturer Package Identifier | HCLGA-DM00231908 |
Packaging | Tape & Reel (TR) |
Size / Dimension | 0.118Lx0.157W 3.00mmx4.00mm |
JESD-609 Code | e4 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 4 |
Termination | Solder Pads |
Type | MEMS (Silicon) |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
Max Operating Temperature | 85°C |
Min Operating Temperature | -40°C |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Number of Functions | 1 |
Frequency | 2.4MHz |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | MP34 |
JESD-30 Code | R-CBGA-N4 |
Output Type | Digital, PDM |
Operating Supply Voltage | 1.8V |
Temperature Grade | INDUSTRIAL |
Max Supply Voltage | 3.6V |
Min Supply Voltage | 1.6V |
Current | 650μA |
Direction | Omnidirectional |
Frequency Range | 100Hz~10kHz |
Sensitivity | -26dB ±3dB @ 94dB SPL |
Port Location | Top |
S/N Ratio | 64dB |
Height | 1.1mm |
Length | 4mm |
Width | 3mm |
RoHS Status | ROHS3 Compliant |
Factory Lead Time | 1 Week |
Lifecycle Status | ACTIVE (Last Updated: 7 months ago) |
Surface Mount | YES |
Shape | Rectangular |