Parameters |
Package / Case |
1023-BFBGA, FCBGA |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Published |
2008 |
Series |
MPC85xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8572 |
Speed |
1.5GHz |
Core Processor |
PowerPC e500 |
Voltage - I/O |
1.5V 1.8V 2.5V 3.3V |
Ethernet |
10/100/1000Mbps (4) |
Number of Cores/Bus Width |
2 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR2, DDR3 |
Additional Interfaces |
DUART, HSSI, I2C, RapidIO |
Co-Processors/DSP |
Signal Processing; SPE, Security; SEC |
Security Features |
Cryptography, Random Number Generator |
RoHS Status |
ROHS3 Compliant |
MPC8572ELPXAVNE Overview
With a packing size of 1023-BFBGA, FCBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved using advanced packaging method Tray. CPUs have 2 Core 32-Bit cores/bus width. Obtain a basic understanding of operating temperature around 0°C. In the MPC85xx series, it is found. With a core count of PowerPC e500, this CPU is multicore. The CPU contains DDR2, DDR3 RAM controllers. This microprocessor has DUART, HSSI, I2C, RapidIO interfaces to serve you better. 1.5V 1.8V 2.5V 3.3V is the I/O speed of this CPU. You can search for variants of a microprocessor with MPC8572.
MPC8572ELPXAVNE Features
PowerPC e500 Core
MPC8572ELPXAVNE Applications
There are a lot of NXP USA Inc. MPC8572ELPXAVNE Microprocessor applications.
- Medical instruments
- Robotic prosthetic limbs
- Broadband technology, video and voice processing
- Answering machines
- Xbox
- Keyboards
- Industrial instrumentation devices
- Network communication, mobile communication field
- Smart instruments
- Binding machines